Tietueen sitaatit
APA-viiteIEEE Workshop on Signal Propagation on Interconnects, Components, Packaging & Manufacturing Technology Society. Technical Committee on Electrical Design, Modeling and Simulation, & IEEE Computer Society. Technical Council on Test Technology. (2006). 10th IEEE Workshop on Signal Propagation on Interconnects: May 09-12, 2006, "Dorint Sofitel Schweizerhof Berlin", Berlin, Germany : proceedings. IEEE.
Chicago-tyylinen lähdeviittausIEEE Workshop on Signal Propagation on Interconnects, Packaging & Manufacturing Technology Society. Technical Committee on Electrical Design Components, ja IEEE Computer Society. Technical Council on Test Technology. 10th IEEE Workshop on Signal Propagation on Interconnects: May 09-12, 2006, "Dorint Sofitel Schweizerhof Berlin", Berlin, Germany : Proceedings. IEEE, 2006.
MLA-viiteIEEE Workshop on Signal Propagation on Interconnects, et al. 10th IEEE Workshop on Signal Propagation on Interconnects: May 09-12, 2006, "Dorint Sofitel Schweizerhof Berlin", Berlin, Germany : Proceedings. IEEE, 2006.
Harvard-tyylinen lähdeviittausIEEE Workshop on Signal Propagation on Interconnects, Components, P. &. M. T. S. T. C. o. E. D. & IEEE Computer Society. Technical Council on Test Technology. 2006. 10th IEEE Workshop on Signal Propagation on Interconnects: May 09-12, 2006, "Dorint Sofitel Schweizerhof Berlin", Berlin, Germany : proceedings. IEEE.