Formation of the intermetallic compounds between liquid Sn and different Cu-Ni metalization
Finna-recension
Formation of the intermetallic compounds between liquid Sn and different Cu-Ni metalization
Sparad:
| Fysisk beskrivning |
14 sivua : kuvitettu ; 30 cm |
|---|---|
| Språk |
engelska |
| Utgivare |
Espoo :
Helsinki University of Technology,
2001.
|
| Serie | Helsinki University of Technology. Department of Electrical and Communications Engineering. Laboratory of Electronics Production Technology, ISSN 1457-0440; 4 |
| Klassifikation | |
| Ämnen | |
| Mer information | Vesa Vuorinen, Tia-Marje Korhonen and Jorma K. Kivilahti |
| ISBN |
951-22-5629-0 pehmeäkantinen |
| Standardkoder |
(FI-MELINDA)000247820 20220831220128.0 |
| Standardnummer |
HUT-EPT-4 |