Formation of the intermetallic compounds between liquid Sn and different Cu-Ni metalization
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Formation of the intermetallic compounds between liquid Sn and different Cu-Ni metalization
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| Physical Description |
14 sivua : kuvitettu ; 30 cm |
|---|---|
| Language |
English |
| Publisher |
Espoo :
Helsinki University of Technology,
2001.
|
| Series | Helsinki University of Technology. Department of Electrical and Communications Engineering. Laboratory of Electronics Production Technology, ISSN 1457-0440; 4 |
| Classification | |
| Subjects | |
| Additional Information | Vesa Vuorinen, Tia-Marje Korhonen and Jorma K. Kivilahti |
| ISBN |
951-22-5629-0 pehmeäkantinen |
| Standard Codes |
(FI-MELINDA)000247820 20220831220128.0 |
| Standard number |
HUT-EPT-4 |